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IPC releases specification for rigid printed boards.

2015-09-29 14:31:08| Industrial Newsroom - All News for Today

IPC has released IPC-6012D, Qualification and Performance Specification for Rigid Printed Boards. Revision D includes updated requirements for dielectric removal, HASL solder pots, printed board edges, and markings and solder mask coverage. Most anticipated addition is new microvia requirements for both capture and target lands. Annular ring, plating to land separation, and voiding in plated and copper filled structures are some examples where revision addresses microvia structures.

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