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IPC's Revised BGA Guideline Features Expanded Focus on Mechanical Reliability
2013-01-31 06:00:00| Industrial Newsroom - All News for Today
C revision of IPC-7095, Design and Assembly Process Implementation for BGAs, will help design, assembly, inspection, and repair personnel improve reliability of ball grid arrays (BGAs) and fine-pitch ball grid arrays (FBGAs) in high-density applications. Guideline includes expanded information on mechanical failure issues that occur after assembly. In addition to BGA inspection and repair, guidelines address reliability issues and use of Pb-free joint criteria associated with BGAs. This story is related to the following:Trade Associations
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Category:Industrial Goods and Services
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