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Indium Corporation Features BiAgX(TM): New, High Temperature, Lead-Free Solder Paste ...
2014-03-04 05:00:00| Industrial Newsroom - All News for Today
Indium Corporation will feature its new high-melting lead-free solder paste technology, BiAgX™, at Semicon China on March 18-20 in Shanghai, China.<br /> <br /> BiAgX™ was created specifically for high-reliability electronics assembly applications. Designed as a drop-in replacement for standard high Pb-containing solder pastes, it has passed MSL1 and thermal cycle testing at several power semiconductor customers.<br /> <br /> BiAgX™ is excellent for small, low-voltage QFN ...This story is related to the following:Lead-Free Solder |
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Category:Industrial Goods and Services