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Indium Corporation Features SACM(TM) High-Reliability Solder Paste at APEX
2014-02-25 06:00:00| Industrial Newsroom - All News for Today
Indium Corporation will feature its new technology platform using SACM™ solder paste at APEX March 25-27 in Las Vegas, Nevada.<br /> <br /> SACM™ is a high-reliability solder paste that increases the drop-shock performance in portable electronics by 800%, without compromising on thermal cycling. SACM™ is doped with manganese and contains less silver than other Pb-free solder pastes. The manganese provides increased strength and the reduced silver content provides a more ...This story is related to the following:Solder Paste
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Category:Industrial Goods and Services