<a href="http://www.indium.com/">Indium Corporation</a>’s <a href="http://www.indium.com/biographies/hongwen-zhang/">Dr. HongWen Zhang</a>, Research Metallurgist, will present at the <a href="http://www.binghamton.edu/ieec/symposium2013/symposium2013.html">2013 Electronics Packaging Symposium</a> October 15-16 at Binghamton University in Binghamton, New York.<br />
<br />
Dr. Zhang’s presentation, Processing, Reliability, and Corrosion Resistance of BiAgX for Die-Attach ...