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Indium Corporation Technology Expert to Present at 2013 Electronics Packaging Symposium

2013-10-01 06:00:00| Industrial Newsroom - All News for Today

Indium Corporation&rsquo;s Dr. HongWen Zhang, Research Metallurgist, will present at the 2013 Electronics Packaging Symposium October 15-16 at Binghamton University in Binghamton, New York.<br /> <br /> Dr. Zhang&rsquo;s presentation, Processing, Reliability, and Corrosion Resistance of BiAgX for Die-Attach Applications, compares the corrosion resistance of BiAgX, a drop-in lead-free solder paste solution for high-temperature die-attach applications, to Pb/5Sn/2.5Ag and SAC305.<br /> <br ...

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