<a href="http://www.indium.com/">Indium Corporation</a>’s <a href="http://www.indium.com/biographies/ning-cheng-lee/">Dr. Ning-Cheng Lee</a>, Vice President of Technology, will give two presentations and teach a professional development course at the <a href="http://www.icept.org/">International Conference on Electronic Packaging Technology</a> (ICEPT) August 11-14, in Dalian, China.<br />
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Low Cost High Reliability Assembly of Thermally Warped PoP with Novel Epoxy Flux on ...