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Indium Corporation Technology Expert to Present at IMAPS Advanced Technology Workshop

2013-05-09 06:00:00| Industrial Newsroom - All News for Today

Indium Corporation&rsquo;s Brook Sandy-Smith, Product Support Specialist - PCB Assembly Materials, will present at the International Microelectronics and Packaging Society (IMAPS) Advanced Technology Workshop on Microelectronic Packaging for Medical and Hi-Reliability Devices May 13-14 in Minneapolis, MN.<br /> <br /> Sandy-Smith will present the following papers:<br /> <br /> &bull; A Low-Silver SAC Solder Alloy for High-Reliability Applications. This presentation examines the reliability of ...

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