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Indium Corporation Technology Expert to Present at IMPACT Conference in Taiwan

2013-10-09 06:00:00| Industrial Newsroom - All News for Today

Indium Corporation&rsquo;s Dr. Ning-Cheng Lee, Vice President of Technology, will present at the International Microsystems Packaging Assembly and Circuits Technology conference (IMPACT) on Thursday, October 24 in Taipei, Taiwan.<br /> <br /> Dr. Lee&rsquo;s presentation, A Novel Epoxy Flux on Solder Paste for High-Reliability POP Assembly, discusses a newly-developed epoxy flux, compatible with solder paste, to address the failure of area array packages, such as BGAs, CSPs, and POP, when ...

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