<a href="http://www.indium.com/">Indium Corporation</a>’s <a href="http://www.indium.com/biographies/mario-scalzo/">Mario Scalzo</a>, Senior Technical Support Engineer, will present at the <a href="http://www.smta.org/">Surface Mount Technology Association</a>’s Ohio Valley Expo and Tech Forum, July 11 in Independence, Ohio.<br />
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Scalzo’s presentation, Effects of Thermal Pad Patterning on QFN Voiding, discusses the major challenge of eliminating voids underneath low ...