Indium Corporation technology experts will share their expertise at the 47th International Symposium on Microelectronics organized by the International Microelectronics Assembly and Packaging Society (IMAPS) Oct. 14-16 in San Diego, Calif.<br />
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Dr. Ning-Cheng Lee, vice president of technology, will present Low-Porosity Pressureless Sintering of a Novel Ag Paste for Die-Attach. This presentation discusses Ag paste as the answer to the challenges of service temperature, thermal ...