Indium Corporation technology experts will present at the IPC Southeast Asia High Reliability Conference May 28 in Singapore.<br />
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Sze Pei Lim, technical manager for Southeast Asia, will present Voiding and Reliability of BGA Assemblies with SAC and 57Bi/42Sn/1Ag Alloys. This presentation explores replacing SAC solders with BiSnAg as a low-cost solution and discusses joint mechanical strength, drop test performance, and voiding performance.<br />
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Sehar Samiappan, area technical ...