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Indium Corporation VP of Technology to Present at SMT Hybrid Packaging

2015-04-10 12:31:08| Industrial Newsroom - All News for Today

Indium Corporations Dr. Ning-Cheng Lee, vice president of technology, will present a two-part workshop at SMT Hybrid Packaging 2015, May 5-7 in Nuremberg, Germany. Dr. Lees workshop, DfX for Advanced Soldering Technology, covers the principles of designing for manufacturability (DfM) and reliability (DfR...

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