Indium Corporation was presented with the Global Technology Award for its SACM™ Solder Alloy at Productronica in Münich, Germany on November 12.<br />
<br />
Sponsored by Global SMT Packaging magazine, the award acknowledges outstanding innovations in the printed circuit board assembly and packaging industry. The award was presented to Tim Jensen, Product Manager – PCB Assembly Materials, and Brian Craig, Managing Director – European Operations.<br />
<br />
SACM™ is a ...This story is related to the following:Manganese Alloys | Solder Paste