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Home › Kulicke And Soffa Introduces The APAMA C2W Chip-To-Wafer Thermo-Compression Bonder

 

Kulicke And Soffa Introduces The APAMA C2W Chip-To-Wafer Thermo-Compression Bonder

2015-09-09 07:57:23| metrologyworld Home Page

Kulicke and Soffa Industries, Inc. ("Kulicke & Soffa", "K&S" or the "Company") introduces a new addition to the APAMATM Series of highly adaptive Thermo-Compression (TC) Bonders, the C2W (Chip-to-Wafer) bonder.

Tags: introduces soffa bonder kulicke

Category:Industrial Goods and Services

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