Used for attaching LED and other small semiconductor die to silver and copper lead frames, CA-195 has dispense open time of >24 hr (measured as 25% increase in viscosity) while maintaining optimized rheology for pin transfer or needle dispensing. Electrically conductive solution features glass transition temperature (Tg) that facilitates wire bonding small die, low extractable ionics as well as adhesion to silver and copper lead frames.<br />
This story is related to the following:Die Attached Adhesives | Thermally Conductive Adhesives