Respectively available in 4.26 x 4.26 x 0.62 mm and 5.90 x 5.90 x 0.62 mm packages with 0.4 mm pitch, BD99991GW and BD99992GW enable fanless designs of such space-conscious mobile PC products as Ultrabooks™, 2-in-1 detachables, and tablets built around Intel® 14 nm Skylake CPU. BD99991GW supports core power rails required by the Skylake platform and Intel IMVP8 power management interface, while BD99992GW provides additional 10 power rails.