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Low-Profile Heatsinks enhance space-constrained designs.

2015-07-29 14:31:06| Industrial Newsroom - All News for Today

Optimized for deployment in streamlined, high-density electronic designs, LPH00xx series utilizes VersarienCu™ microporous copper technology and offers form factors that cover 10 x 10 x 2 mm through 40 x 40 x 5 mm. Microporous structure maximizes surface area and optimizes heat dissipation in space constrained designs. For applied load of 5 W, thermal resistance of 40 x 40 x 5 mm LPH0010 heatsink is 17.4°C/W, while 20 x 20 x 5 mm LPH0004 offers thermal resistance of 35.8°C/W for 2 W load.

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