Constructed of lightweight aluminum, 8U Model VT811 features 30-layer impedance-controlled backplane with slots for 12 double-wide AMC modules, plus 2 MicroTCA Carrier Hubs and 4 power modules. Clock traces are laid out to give equal track length from MCH to each AMC slot, easing latency equalization. Rear of enclosure allows for 12 double-wide Rear Transition Modules to be inserted. Fan trays are arranged with sixteen 2 in. fans each above and below card cage in push-pull configuration.
This story is related to the following:Advanced Telecom Computing Architecture (ATCA) Developer Chassis | Electronic Enclosures