Home Microfluidics: DARPA is betting embedded water droplets could cool next-gen chips
 

Keywords :   


Microfluidics: DARPA is betting embedded water droplets could cool next-gen chips

2016-03-10 20:54:31| Extremetech

DARPA and Lockheed Martin have a plan to build microfluidic cooling into modern microprocessors. This could dramatically improve CPU cooling and break the bottleneck on clock speed scaling -- at least, for a little while.

Tags: water cool chips embedded

Category:Information Technology

Latest from this category

All news

»
22.11SHIMANO BT Master 11AP)
22.11
22.11
22.11GOLDWIN
22.11Qi10 TOUR 5W WF
22.11
22.11GX HR
22.11 GEORGIA
More »