Optimized for hot roll lamination and processing on MEMS and IC wafers, DF-3050 Dry-film Negative Photoresist is available in thickness formats from 5–50 µm, ±5%. Cured chemistry can withstand harsh environments including extreme moisture conditions and corrosive chemicals. With glass transition temperature of 158°C (By DMA Tan Delta) and moderate modulus of 3.5 GPa at 25°C, DF-3050 is less brittle than most other negative photoresists.