Categories:

• Agriculture and Forestry
• Automotive
• Biotechnology and Pharmaceuticals
• Chemicals
• Construction and Maintenance
• Consumer Goods and Services
• Electronics and Electrical
• Energy and Environment
• Food and Related Products
• Industrial Goods and Services
• Information Technology
• Materials
• Real Estate
• Telecommunications
• Textiles and Nonwovens
• Transportation and Logistics

Popular Tags:

• player
• mp4
• mp4 player
• screen
• player screen
• screen mp4
• 4gb
• player 4gb
• 4gb mp4
• card
• slot
• player card
• 18inch
• inch
• 15inch
• inch mp4
• inch player
• flash
• style
• builtin

Home › Non-Conductive Paste promotes flip chip application reliability.

 

Non-Conductive Paste promotes flip chip application reliability.

2014-02-06 14:30:13| Industrial Newsroom - All News for Today

Designed for flip chip packaging applications, 585-1 Non-Conductive Paste (NCP) promotes reliability for gold stud bump interconnects. Ionically clean product, which cures in seconds during thermal compression bonding at 200°C, exhibits optimized fracture toughness as well as adhesion. This story is related to the following:Solder Paste

Tags: application chip reliability paste

Category:Industrial Goods and Services

Latest from this category	All news
19.11 POWTEX2024 The 25th International Powder Technology Exhibition Tokyo Industrial Goods and Services »	23.11 23.11 WEEZER / maladroit 12\" 23.11 23.11 6'1ML REV-S 23.11 speak up storys 23.11 190mm LS0713FL 23.11 That's Moulton 23.11 SEED More »