ODVA has accepted an invitation by PMMI to join the Association Pavilion at PACK EXPO Las Vegas on Sept 23–25. ODVA’s attendance at the show will provide a critical touchpoint for end users and OEMs who are seeking to learn the benefits about the use of EtherNet/IP and the Common Industrial Protocol in their packaging applications. ODVA will be located at Booth C-343 in the Association Pavilion in the Central Exhibit Hall.