Applied in bond lines as thin as 10–15 microns, Master Bond Supreme 18TC contains thermally conductive fillers. This smooth paste system offers thermal resistance of 5–7 x 10-6 K•m²/W and thermal conductivity of 22–25 BTU•in/ft²•hr•°F. Able to maintain bond strength even when exposed to hostile environmental conditions, product bonds to diverse substrates and offers 2,200–2,400 psi tensile lap shear strength, 6,000–7,000 psi tensile strength, and 22,000–24,000 psi compressive strength.