Meeting electronic device thermal management and miniaturization demands, Cavity PCBs have structural recesses that enable additional functions. Cavities allow positioning of electronic components to give assembled PCB thinner structure. Applied to multilayer PCBs, process allows variations and layouts with several cavities and different depths (if desired) on one circuit board. Cavities can be made using Controlled Depth Routing, sequential lamination with low- or no-flow prepregs, or laser.