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Panel Warpage Measurement System offers single-shot operation.

2015-12-09 14:31:06| Industrial Newsroom - All News for Today

Addressing needs of Fan Out Wafer Level Processing (FOWLP) market, AKM600P enables concurrent and complete, single-shot warpage measurement of entire panel and individual die on panels up to 600 x 600 mm. Complete measurement and analysis of panel of this size provides z-resolution down to 1.25 µm and takes <2 sec to complete using Shadow Moiré technology. Also, warpage measurements can be conducted at room temperature or up to 300°C.

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Category:Industrial Goods and Services

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