Ranging in thickness from 0.5–40 mil with features as small as 4 mil on 0.010 in. centers, Photochemically-Etched Surface-Mount and Insert-Mount Lead Frames are suitable for semiconductors, glass-to-metal seals, and relays as well as medical applications. Single-or double-sided frames can be plated in their entirety or selectively using base materials such as kovar, nickel-iron alloys, copper alloys, and pure nickel. Lead-free plating materials include silver, nickel, gold, or tin.
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