Available in single and dual pad frame types, SOT-227 Power Modules meet requirements of single, dual, or multi-chip die designs. Units are supplied with electrically isolated copper baseplate and aluminum nitride or Alumina substrate to ensure isolation at 3,000 Vrms. Featuring wire-bonded internal connections and screwable electrical terminals, modules support thermal resistance of 40°C/W (junction-to-ambient) and 0.18 to 0.6°C/W (junction-to-case) along with power dissipation of 110–700 W.
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