je.st
news
Rudolph Ships JetStep Lithography System for High-Volume Fan-Out Packaging Applications
2015-02-02 15:29:40| Semiconductors - Topix.net
This new customer will use the JetStep W Series for fan-out wafer level packaging applications. "The customer was seeking to add capacity for ramp in 2015 and chose our JetStep solution because it offered them a 20-30 percent productivity improvement over their existing lithography tool set, and better overlay performance, which is expected to result in higher yields.
Tags: system
applications
ships
packaging
Category:Electronics and Electrical
Latest from this category |
All news |
||||||||||||||||||||
|
|
||||||||||||||||||||