Albany, NY – YINCAE Advanced Materials, LLC is pleased to announce the release and availability of BP 256. It is a part of the innovative SMT 256/266 series, solder joint encapsulant.<br />
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YINCAE's BP 256 is for BGA, CSP, Flip Chip, POP, and other ball bumping applications. The BP 256 can enhance solder joint reliability and eliminate solder joint cracking in microchip applications, creating a solder joint bond that is 5-to-10 times stronger than a conventional solder joint. ...This story is related to the following:Adhesives and SealantsSearch for suppliers of: Reflow Encapsulants |