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Solder Pastes help reduce potential for tombstoning.

2014-02-11 14:32:02| Industrial Newsroom - All News for Today

Offered as option with solder paste fluxes, anti-tombstoning solder pastes are suited for use when it is difficult to change reflow profile. Modification of alloy to introduce melting range results in equalization of wetting forces. Because of this, small components are prevented from tombstoning. Optimal wetting characteristics apply to all surface finishes, including OSP, Ni/Au, Ni/Pd/Au, Sn, and Ag. No-clean and water-soluble, as well as lead-free and leaded formulations, are available. This story is related to the following:Flux Filled Solder | Solder Paste |

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Category:Industrial Goods and Services

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