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Synopsys Demonstrates Industry's First SuperSpeed USB Inter-chip (SSIC) Interoperability

2013-09-11 06:00:00| Industrial Newsroom - All News for Today

Successful SSIC Interoperability Reduces Integration Risk and Speeds Time-to-Market for Mobile and Wireless Designs<br /> <br /> MOUNTAIN VIEW, Calif.<br /> <br /> Highlights: <br /> <br /> &bull; Synopsys demonstrates industry's first SSIC interoperability at Intel Developer Forum 2013, September 10-12 in San Francisco, Calif.<br /> <br /> &bull; Demonstration shows DesignWare USB 3.0 IP for SSIC transferring data to and from an Intel SSIC development platform<br /> <br /> &bull; Implementing ...This story is related to the following:Mechanical Components and AssembliesDigital Controls | Electronic Design Automation (EDA) Software

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