Successful SSIC Interoperability Reduces Integration Risk and Speeds Time-to-Market for Mobile and Wireless Designs<br />
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MOUNTAIN VIEW, Calif.<br />
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Highlights: <br />
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• Synopsys demonstrates industry's first SSIC interoperability at Intel Developer Forum 2013, September 10-12 in San Francisco, Calif.<br />
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• Demonstration shows DesignWare USB 3.0 IP for SSIC transferring data to and from an Intel SSIC development platform<br />
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• Implementing ...This story is related to the following:Mechanical Components and AssembliesDigital Controls | Electronic Design Automation (EDA) Software