Available in FX and HX models, Helios™ G4 DualBeam Series offers 7 nm TEM lamella preparation solution for semiconductor manufacturing and failure analysis applications. Flexible FX system delivers STEM resolution down to sub-three Ångströms and enables images to be obtained within minutes of completing lamella. HX model, geared specifically for high-throughput TEM lamella production, features automated QuickFlip holder that minimizes sample preparation times.