Thermal Interface Material (TIM) characterization tools comprise Thermal Test Chips (TTCs) in sizes from 2.5–12.8 mm² mounted on various packages, including BGA, QFN, and DIP. These tools, which include TTV-1100/1200/1500/1800/3000/3100 Series, can also be used to simulate heat sources for validation of thermal simulation, quantify thermal management performance, and establish temperature-controlled platforms for various measurement purposes.
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