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TSMC Certifies ANSYS Power Integrity and Electromigration Solutions for 16nm FinFET Technology
TSMC Certifies ANSYS Power Integrity and Electromigration Solutions for 16nm FinFET Technology
2014-04-15 06:00:00| Industrial Newsroom - All News for Today
PITTSBURGH – ANSYS, Inc. (NASDAQ: ANSS) announced today that its RedHawk™ and Totem™ products are certified for production version 1.0 of Design Rule Manual (DRM) and SPICE model tool certification for TSMC 16-nanometer (nm) FinFET technology. TSMC has certified these solutions for static and dynamic voltage drop analysis and signal and power electromigration (EM) verification.<br /> <br /> FinFET technology is a three-dimensional transistor architecture that results in ...This story is related to the following:Engineering Software | CAE Software | Data Analysis Software |
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