Optimized for protecting chipsets on high-speed data lines such as USB 3.0 and HDMI, SP3012-06UTG safely absorbs repetitive ESD strikes above maximum level specified in IEC61000-4-2 international standard (Level 4) without performance degradation. Dynamic resistance of just 0.4 Ω lowers clamping voltage for reliable chipset performance in field. Supplied in 3.5 x 1.35 x 0.5 mm µDFN-14 package, product offers 0.5 pF capacitance and lets PCB traces to run directly underneath device.
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