An early teardown of Apple's iPhone SE - the 4-inch smartphone that retails for a comparatively low $399 - found relatively few components that haven't shown up in previous iPhone models. New components include a power applier module from Skyworks Solutions Inc., a power management IC from Texas instruments Inc. and NAND flash from Toshiba Corp., according to Chipworks, an engineering analysis firm that performed one of the earliest teardowns on the handset.