Home › Tencent raises USD 6 bln in bond offering, pledges investment of USD 70 bln into cloud, AI, cybersecurity
 

Keywords :   


Tencent raises USD 6 bln in bond offering, pledges investment of USD 70 bln into cloud, AI, cybersecurity

2020-05-29 15:43:00| Telecompaper Headlines

(Telecompaper) The company has pledged to invest USD 70 billion into new infrastructure over the coming five years, Reuters noted, citing a statement to state media by company SVP Dowson Tong. The money will go into cloud computing, artificial intelligence and cybersecurity, and namely in blockchain, servers, big data centres, supercomputer centres, IoT operating systems, 5G networks and quantum computing. [ more ]

Tags: investment offering usd bond

Category:Telecommunications

Latest from this category

All news
28.04Rack Gives Back: Compassion in Action
24.04Accelerate Cloud Transformation with a Smart Path to AWS Migration
Telecommunications »
02.05US jobs grow by more than expected despite tariff turmoil
02.05General Nonwovens Announces 40 Million Investment
02.05SGN Introduces Next Generation Spunbond
02.05WEG Adds Heresite Protective Coatings
02.05RPM Completes Acquisition of The Pink Stuff
02.05Co-op gives away free pasta sauce and coffee by mistake
02.05BASF Releases Financial Figures for First Quarter 2025
02.05Circular Materials Expands Recycling Across New Brunswick
More »