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Home › Thermal Analysis Devices deliver long-term stability, durability.

 

Thermal Analysis Devices deliver long-term stability, durability.

2015-11-20 14:31:05| Industrial Newsroom - All News for Today

With FlexCal® technology that automatically applies calibration parameters to match heating rate, method gas, and crucible type, bottom-bonded surface stabilized DSC sensors offer indium height to width ratio of 19.5 mW/°C and >155 mW/°C when applying data optimization. DSC 3+ is operated by 14.0 STARe Thermal Analysis software with single frequency modulated temperature technique and optional TOPEM® multi-frequency modulated technique. TGA/DSC 3+ has XP micro- and XPU ultra-microbalances.

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