With halide-free, rosin-based chemistry, NC722 no-clean solder paste can be used with low-temperature alloys, such as Sn42/Bi58, and lends repeatability and consistency to printing process. Product meets/exceeds requirements for ANSI/J-STD -004/-005 as well as all Bellcore test criteria for solder pastes and features non-hygroscopic, low voiding/high-reliability formulation suited for high RH areas. Residues left behind are clear and maintain virtually indefinite pin probability life.
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