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Home › Toughened One Component Epoxy for Chip Coating Applications Meets NASA Low Outgassing Specifications

 

Toughened One Component Epoxy for Chip Coating Applications Meets NASA Low Outgassing Specifications

2016-02-24 11:31:09| Industrial Newsroom - All News for Today

Formulated for many electronic applications, Master Bond Supreme 3HTND-2CCM is a multifunctional epoxy that is well suited for chip coating, glob top and die attach applications as well as for bonding, sealing and encapsulation. Since it is a one part system, it does not require mixing and has an unlimited working...

Tags: low applications component specifications

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