SWITZERLAND – Tresky, a worldwide leading manufacturer of micro-assembly systems, announces that iMAPS The 46th International Symposium on Microelectronics, held in Orlando, FL from September 30-October 3, 2013, was a fruitful and exciting show.<br />
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While the show was successful from start to finish, the product highlight included the automatic die bonding system T-6000, which generated much interest and many visitors. Adding to the success, Daniel Schultze, Sales Director at ...This story is related to the following:Die Bonders |