Home › True 3-D Chips Harness Nanotubes | EE Times
 

Keywords :   


True 3-D Chips Harness Nanotubes | EE Times

2014-12-19 21:02:53| Semiconductors - Topix.net

True three-dimensional chips were demonstrated recently at the 2014 International Electron Devices Meeting by Stanford University. Most 3-D chips use through-silicon-vias to stack separately manufactured dies, such as the Hybrid Memory Cube, which stacks DRAM die by Micron Technology, Inc., of Boise, Idaho.

Tags: times true ee chips

Category:Electronics and Electrical

Latest from this category

All news
»
05.05Is Zimbabwe zigzagging into further currency chaos?
05.05Why mortgage rates are going up, not down
04.05This Week in Agribusiness, May 4, 2024
04.05Weekly Recap: Sherwin-Williams, BASF, Abrafati Top This Weeks Stories
03.05'Garden floods show need to work with nature'
03.05Worst-ever job interviews: 'We had to crawl and moo'
03.05Have the wheels come off for Tesla?
03.05BW Converting focuses on time, energy and cost savings at INFOFLEX
More »