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UV Cure Adhesive suits circuit assembly applications.

2015-04-27 14:31:07| Industrial Newsroom - All News for Today

Designed to cure rapidly when exposed to high-intensity UV light, 535-11M-7 Epoxy is suitable for lens bonding in camera modules, chip encapsulation in smart cards, and variety of general bonding applications in photonics assembly. Flexible, high-strength epoxy adhesive is non-conductive, low-outgassing, and does not contain antimony.

Tags: applications assembly circuit cure

Category:Industrial Goods and Services

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