Home UV Cure Adhesive suits circuit assembly applications.
 

Keywords :   


UV Cure Adhesive suits circuit assembly applications.

2015-04-27 14:31:07| Industrial Newsroom - All News for Today

Designed to cure rapidly when exposed to high-intensity UV light, 535-11M-7 Epoxy is suitable for lens bonding in camera modules, chip encapsulation in smart cards, and variety of general bonding applications in photonics assembly. Flexible, high-strength epoxy adhesive is non-conductive, low-outgassing, and does not contain antimony.

Tags: applications assembly circuit cure

Category:Industrial Goods and Services

Latest from this category

All news

19.11POWTEX2024 The 25th International Powder Technology Exhibition Tokyo
Industrial Goods and Services »
23.114 ver. 6
23.11120
23.11 3rd tour DOUBLE STAR Blu-ray
23.11PSA8_
23.11/nd
23.11
23.11 #49
23.115in1UP
More »