Home UV Cure Adhesive suits circuit assembly applications.
 

Keywords :   


UV Cure Adhesive suits circuit assembly applications.

2015-04-27 14:31:07| Industrial Newsroom - All News for Today

Designed to cure rapidly when exposed to high-intensity UV light, 535-11M-7 Epoxy is suitable for lens bonding in camera modules, chip encapsulation in smart cards, and variety of general bonding applications in photonics assembly. Flexible, high-strength epoxy adhesive is non-conductive, low-outgassing, and does not contain antimony.

Tags: applications assembly circuit cure

Category:Industrial Goods and Services

Latest from this category

All news

»
14.11
14.115
14.11MTGfoil
14.11
14.11sw14000XH 8000
14.11katie
14.11EX 330 HP SAR
14.11 M1
More »