Home › UV Cure Adhesive suits microelectronic assembly applications.
 

Keywords :   


UV Cure Adhesive suits microelectronic assembly applications.

2013-05-31 14:31:38| Industrial Newsroom - All News for Today

Designed to eliminate any warpage of components in disk drive assemblies, nonconductive and ionically clean 535-18M-57 is also suited for lens bonding in camera modules, chip encapsulation in smart cards, and various general bonding applications in photonics assembly. Low-outgassing, flexible, high-strength epoxy adhesive cures when exposed to high-intensity UV light and does not contain antimony. Product offers minimal stress, shrinkage, and glass transition temperature values.<br /> <br /> This story is related to the following:Ultraviolet (UV) Adhesives |

Tags: applications assembly cure suits

Category:Industrial Goods and Services

Latest from this category

All news
15.09Your MANA RepFinder Profile
13.09A League of Their Own Womens Special Interest Group Invites You to Attend a MANAchat on September 26
Industrial Goods and Services »
21.09Atlantic Tropical Weather Outlook
21.09Eastern North Pacific Tropical Weather Outlook
21.09Atlantic Tropical Weather Outlook
21.09Eastern North Pacific Tropical Weather Outlook
20.09Labelexpo Americas highlights, Maxcess announces acquisition and more
20.09September Cattle on Feed as expected
20.09USDA announces major investment in meat and poultry processing
20.09Atlantic Tropical Weather Outlook
More »