Producing TEM00 (M² <1.3) output beam, Daytona™ 355-20 delivers over 20 W of power in sub-nanosecond pulses, at repetition rates over 1 MHz at 355 nm. Platform can be adjusted to match exact needs of particular application. For example, pulsewidth can be adjusted from <1 ns to 20 ns, while repetition rate can go from single shot to over 2 MHz. Applications include wafer dicing, scribing, and drilling; glass scribing for touch panels and LCDs; and thin film scribing for PV manufacturing.
This story is related to the following:Fiber Lasers | Scribing Lasers