je.st
news
Ultra Compact SMD Photodiode Package: AD230-8 SMD
2014-03-04 16:40:58| autocentral Products
First Sensor presents a new ultra compact flat no-leads package (QFN, ODFN) for its APDs and PIN photodiodes. The plastic encapsulated reflow solderable SMD package features a footprint of only 4 mm² and very good resistance to moisture (MSL3). Applications include laser distance meters, rangefinders, LIDAR, high speed photometry, optical fiber communication, and more.
Tags: package
ultra
compact
smd
Category:Automotive
Latest from this category |
All news |
||||||||||||||||||||
|
|
||||||||||||||||||||