Offering ductility and resistance to cracking during demolding and machining, KetaSpire® KT-810 features melt viscosity ranging from 0.51–0.65 kPa-s compared to 0.38-0.50 kPa-s for standard high-viscosity PEEK grades. Material is available in fine powder with average particle size of approximately 50 µm for compression molding, and pellet form for extrusion and injection molding. Ultra-high molecular weight grade is targeted for semiconductor and oil and gas applications.
This story is related to the following:PEEK Resins |