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Home › UltraSource, Inc. Featured In Publication Microwave And Millimeter Wave Electronic Packaging'

 

UltraSource, Inc. Featured In Publication Microwave And Millimeter Wave Electronic Packaging'

2014-03-17 08:49:11| rfglobalnet Home Page

Michael Casper, President & CEO of UltraSource, Inc., a thin film ceramic microchip manufacturer is pleased to announce that UltraSource, Inc. is featured in the publication titled “Microwave and MillimeterWave Electronic Packaging” by Rick Sturdivant and published by Artech House.

Tags: publication featured electronic wave

Category:Telecommunications

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