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Home › UltraSource, Inc. Releases New Thin Film Microcircuit CopperVia

 

UltraSource, Inc. Releases New Thin Film Microcircuit CopperVia

2013-01-10 04:45:39| wirelessdesignonline News Articles

Michael Casper, President & CEO of UltraSource, Inc., a supplier of custom thin film circuits and ceramic interconnect devices, announced the newCopperVia, based on their existing patented UltraVia process.

Tags: film releases thin thin film

Category:Telecommunications

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